- Phenolic Resin for Friction material
- Phenolic Resin for Plastic mould
- Phenolic Resin for precoated sand
- Phenolic Resin for abrasives
- Phenolic Resin for scouring pad
- Phenolic Resin for wood adhesive
- Phenolic Resin for refractory thermal insulating material
- Phenolic Resin for Insulation board
- Phenolic Resin for cord fabrics
- Phenolic Resin for electronic Materials
- Phenolic Resin for Tire rubber
- Phenolic Resin for carbon molecular sieves
- Phenolic Resin for Flower mud
- Phenolic Resin for Decorative paper material
- Phenolic Resin for Audio equipment
- Phenolic Resin for Other fields
Phenolic Resin for electronic Materials
Phenolic Resin for electronic Materials
Thermoplastic phenolic resin solution is used as a curing agent for epoxy resin. Can bond electronic laminates, improve the heat resistance of their products, and apply to the soldering process of printed circuit boards
Technical Specifications
| model | Exterior | Viscosity （mPa·s/25℃） | Solid content （%/150℃/1h） | Free phenol (%) | Softening Point （℃） | Solvent |
| Y1001 | Light yellow liquid | 1000-1300 | 65-70 | <0.5 | 95-105 | Butanone |
Precautions
- 1 This product is a liquid resin that prevents splashing.
- 2 Wear relevant protective equipment during the application process to avoid direct contact with the s
Packaging and storage
- 1 This product is galvanized iron drum, net weight: 200KG / barrel.
- 2 Store in a dry, cool and well-ventilated place. Be careful not to break the barrel. Use immediately
- 3 Stores up to 15°C for 12 months.